ASEAN Briefing News

Three Key Factors Impacting Human Resource Development in ASEAN

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Digital transformation, climate change and green investments, and ageing societies present new challenges and opportunities for foreign investors in ASEAN.

The US-ASEAN Expanded Economic Engagement Initiative

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The US-ASEAN Expanded Economic Engagement Initiative is a framework to promote increased trade and investment cooperation between the US and ASEAN.

The US-ASEAN Trade and Investment Facilitation Agreement Explained

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The US and ASEAN have agreed on an updated TIFA arrangement for 2021-22, along with an Expanded Economic Engagement (E3) Work Plan.

Singapore Exchange Becomes the First Major Bourse in Asia to Allow SPAC Listings

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As of September 3, 2021, the Singapore Exchange is among Asia’s first major bourse to allow the listing of special purpose acquisition companies (SPACs).

Indonesia’s Omnibus Law: Changes to the Immigration Law

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Indonesia issued Government Regulation 48 of 2021 (GR 48/2021) in March 2021 which amends the country’s immigration law.

Electronic Signatures in Singapore: What Businesses Need to Know

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Individuals and companies are increasingly using electronic signatures, or e-signatures, to sign contracts and complete other transactions in Singapore.

EU-ASEAN Trade Facilitation: The ARISE Plus Program

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The ASEAN Regional Integration Support from the EU (ARISE and ARISE Plus) are programs supporting the facilitation of trade and economic integration in ASEAN.

ASEAN Trade Partners Meeting: Developments with the US, EU, Hong Kong, India and Russia

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Economic ministerial-level consultation meetings between ASEAN and its partners – the US, Hong Kong, India, the European Union, and Russia.

Digital Banking in Malaysia: New Opportunities for Fintech

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Malaysia’s central bank is set to issue its first digital banking licenses in early 2022, a move that could position the country as one of Southeast Asia’s leaders in fintech.

High-Tech in Thailand: Incentives for R&D, Semiconductors, and Smart Packaging

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Thailand has released new incentives for investments in R&D, semiconductor manufacturing, smart packaging, and other digital technologies.

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